Method for manufacturing wafer level semiconductor device formed protecting layer

A method for manufacturing a wafer level semiconductor device is provided to simplify manufacturing processes and to reduce remarkably a protection layer forming time by forming a protection layer around a semiconductor chip using a screen printing process. A plurality of semiconductor chips are formed on a wafer(10). A groove is formed between adjacent semiconductor chips by performing a first sawing process on a rear surface of the wafer. A screen printing process is performed on the rear surface of the wafer to form a protection layer(40) capable of filling completely the groove. The resultant structure is then divided into discrete semiconductor devices by performing a second sawing process along the protection layer of the groove.