The highly integrated mobile WiMAX module using embedded PCB & SIP technology

The highly integrated mobile WiMAX module is presented by employing embedded PCB and system in package technology. It is one chip solution that is composed of WiMAX Chipset, memory, EEPROM, TCXO, PMIC and RF Front End. Furthermore, RF components such as LPF, BPF and Balun are embedded in the multilayered organic substrate. The total size of module targeted is 15mm × 15mm × 1.34mm. The measured results of the mobile WiMAX module show the Rx sensitivity of typical −98dBm and error vector modulation of −28dB in the Tx band with 3.3 V supply. The proposed module is compatible with IEEE802.16e standard. In this paper, the high performance RCT (Radio Conformance Test) results of WiMAX module can be achieved by using embedded BPF, LPF with low insertion loss of the 2.07dB and 0.65dB, respectively.