Properties of lead-free conductive thick films of co-precipitated silver–palladium powders

Abstract Silver–palladium alloy films were made by thick film technique using three types of powders prepared by co-precipitation route. The powders were prepared by varying the palladium weight contents (5, 10 and 15% Pd and denoted as Pd5, Pd10 and Pd15, respectively). The powders were analyzed by XRD, SEM/EDAX and TG/DTA. The average particle size of the prepared powders ranged from 100 to 200, 100 to 400 and 100 to 500 nm, respectively. The change in surface texture of the three types of films fired at different temperatures showed the change in their sintering behavior and electrical properties. The films (all three compositions) fired at 850 °C showed comparatively smooth texture and the lowest sheet resistance than those of fired at other temperatures (i.e. 750 and 800 °C).