Surface formed carrier for semiconductor chips and process for its preparation

The invention relates to a two-dimensional support which is comprised of a flexible, dielectric material. At least one semiconductor chip having a conducting path structure especially for carrying out contactless data transmission is placed on said support. The invention also relates to a method for producing the two-dimensional support and to the use thereof. Such a support for semiconductor chips and a method for the production thereof should make it possible to easily and economically provide or produce elements for carrying out contactless data transmission. To this end, the conducting path structure (3) comprised of an electrically conductive polymer or adhesive is directly pressed onto the support (1). Particularly suited supports are paper, cardboard, paperboard or a textile material.