The thermal and electrical properties of CoMo alloys as copper adhesion/barrier layers

CoMo alloys as copper diffusion barriers were investigated in this work. The thermal stability was studied after annealing, which was measured by FPP, XRD, SEM and AES. According to the electrical test, we carried out a new p-cap structure to measure. The breakdown electrical field and C-V properties were measured at 150°C. Both the thermal test and electrical results show CoMo is a potential diffusion barrier.