Water-base cutting liquid for hard and brittle materials and preparation method and application thereof

The invention provides a water-base cutting liquid for hard and brittle materials. The liquid is characterized by comprising the following components in percentage by weight: 70 to 95 percent of poly-alkoxy compound, 0 to 5 percent of extreme-pressure resistant chelating agent, 0.001 to 5 percent of anti-settling re-dispersing agent and 4 to 20 percent of deionized water. The cutting liquid of the invention has the characteristics of no pollution and low metal impurity content; at the same time, the stability of a motar formed by mixing the cutting liquid and grinding material carborundum is high and grinding material carborundum re-dispersing capacity is high; and the cut product has the advantages of high yield, high qualification rate, high surface cleanliness, easy cleaning and the like. The invention also relates to the application of the cutting liquid to processing monocrystalline silicon, polycrystalline silicon, germanium, gallium arsenide, quartz, gallium indium nitride or precious stones.