Semiconductor device and manufacturing method of a semiconducting tervorrichtung

A manufacturing method of a semiconductor device (10) includes placing a mask (20) having an opening (42) on an external portion (24) of a top of a substrate (18) to an end portion (44) of the opening of the mask directly on a concave arranging portion (20) formed on the top surface of the substrate, wherein the external portion is located outside of the concave portion. The manufacturing method further comprises: growing a conductive layer (16) on a part of the upper surface of the substrate through the mask after the mask is placed on the substrate, wherein the portion includes the top of the concave portion; and removing the mask from the substrate after the conductive layer is grown.