Epoxy resin compositions based on bisphenol a typed epoxy resin for high pressure resin transfer molding

Modified epoxy resins; A first bisphenol F type epoxy resin composition comprising 80 to 90 parts by weight based on bisphenol F type epoxy resin composition as a whole wherein the first bisphenol F type epoxy resin composition by weight of the compound of the formula (4); A first bisphenol F type distilled to have a high purity than the epoxy resin composition of claim 2, bisphenol F type epoxy resin composition; And a curing agent; High pressure resin transfer molding (High-Pressure Resin Transfer Molding: HP-RTM) for containing the bisphenol F epoxy resin based on the epoxy resin composition is provided. [Formula 4]