Silicon-Photonics-Embedded Interposers and Their Applications

We propose silicon (Si)-photonics-embedded interposers to minimize the Si photonics chip size and achieve highly precise optical fiber alignment. The interposers are organic interposer substrates that have Si photonics transceiver dies buried in the substrate and polymer optical waveguides connecting the Si chips and optical connectors. We investigated the effect of the embedding process on the operation of half-buried Si-photonics transceiver chips in an organic substrate and successfully observed 25-Gb/s operations. The Si-photonics-embedded interposer is expected to be a co-packaged optics platform to eliminate the interconnect bandwidth bottleneck for high-performance computing systems.