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Three dimensional flip chip packaging in low temperature cofired ceramic for high density microwave applications
Three dimensional flip chip packaging in low temperature cofired ceramic for high density microwave applications
1997
W. Marsh
M. Kline
F. Kuss
D. Strack
M Berry
Keywords:
Ceramic
Electronic packaging
Metallizing
Flip chip
Electronic engineering
Microwave
Integrated circuit
Materials science
Electrical engineering
high density
microwave applications
Optoelectronics
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