Improved control of TiN coating properties using cathodic arc evaporation with a pulsed bias

Abstract A combined d.c.-pulse bias voltage was used in combination with a cathodic arc evaporation process for the deposition of TiN on planar plates and drilling tools at substrate temperatures T between 330 and 500 °C. This new pulse technique appeared to be a powerful tool to achieve independent control of the substrate temperature, coating adhesion and uniformity of deposition. As a result, high coating adhesion can be obtained at low substrate temperatures. The adhesion uniformity across large-area samples is considerably improved. Unpolished rough substrate parts can be coated without cauliflower-like growth defects. Because of intensive ion bombardment in the pulse period, smoother TiN coatings with a reduced droplet size were obtained.