Trends in Hitachi's MEMS Sensors for Automobiles

INTRODUCTION SINCE it began working on the development of semiconductor pressure sensors using bulk MEMS (microelectromechanical systems) fabrication technology for fabricating three-dimensional silicon substrates in 1970, Hitachi has been developing technologies such as MEMS fabrication technology and the integration of MEMS and signal processing circuits, while working to commercialize these technologies. At present, Hitachi is also focusing on the creation OVERVIEW: Computerized and electronic control technologies for automotive systems such as engine powertrain control, vehicle stability control, and brake control have been evolving year after year, making the establishment of the sensing technologies used to acquire the various types of information necessary to control these systems indispensable. MEMS is a core technology that supports this, and a wide variety of different MEMS sensors are currently being used on board automobiles. Ever since Hitachi first commercialized semiconductor pressure sensors in 1980, Hitachi has been working to apply MEMS technology to devices such as accelerometers, airflow sensors, and so on. Furthermore, in 2009, Hitachi developed a combined sensor that measures automobile acceleration along two axes (back and forth plus side to side) as well as rotation (angular rate), and is working to gradually begin applying this sensor to its vehicle electrical stability control system starting in 2011, as this system will become mandatory in North America and Europe.