Gravure offset printing of polymer inks for conductors

Abstract A gravure offset printing process has been developed for Ag-filled polymer conductor ink. Pad printing and roller type printing have been used. Curing and electrical properties have been studied. A roller type of gravure offset printing has been used to evaluate the printing process and pad printing to print on the non-planar substrates. Based on differential scanning calorimetry (DSC) and resistivity measurements during ink curing, it was found that the ink had an optimum curing temperature of 140 °C. Square resistance of 300 and 150 μm wide lines can be as low as 20 and 28 mΩ/sq., respectively, for 7–8.5 μm thick line. The minimum line width was 70 μm. This minimum line width can be reduced with different ink solvents, but in this case the line thickness suffers and the square resistance increases, respectively.