The epoxy resin composition for copper clad laminate

The present invention relates to an epoxy resin composition for a printed circuit board (Printed Circuit Board, PCB). More specifically, the present invention provides a) a bisphenol A type novolak epoxy resin, the average epoxy equivalent of 100 to 500; b) a trifunctional or higher polyfunctional epoxy resin average epoxy equivalent of 100 to 500; c) a brominated phenolic curing agent; d) a bisphenol A type novolak phenolic curing agent; e) a curing accelerator already containing imidazole compounds; And f) an epoxy resin for a printed circuit board comprising a nanoclay in the organic and mineral fillers form, which is an organic material bonded to the layered silicate layer adhesive composition and prepreg that (Prepreg) and a copper-clad laminate using the same (Copper Clad Laminate, CCL ) it offers. The epoxy resin composition of the present invention exhibits the combined organic material an organic and inorganic filler forms, including nanoclay of excellent heat resistance, high glass transition temperature (Tg, Glass Transition Temperature), excellent flame retardancy and mechanical properties in the layered silicate layer It can be advantageously used in the manufacture of printed circuit boards for the CCL. Nano-clay, copper-clad laminates, prepregs