Hot melt adhesive in the form of granules

Moisture-curing hot-melt adhesive composition in granule, lozenge or powder form can be prepared by DOLLAR A a) melting of the reactive hot melt adhesive composition and heating the melt to temperatures of between 110 DEG C and 180 DEG C., preferably 130 DEG C to 150 DEG C in the absence from moisture, DOLLAR a b) extruding said melt through nozzles having a diameter of 0.5 mm to 30 mm, preferably 2 mm to 10 mm on a cooled surface with exclusion of moisture, DOLLAR a c) cooling the granules with exclusion of moisture, the solidified composition DOLLAR a d) removing the cooled hotmelt adhesive granules and, if necessary, post-crystallization in an agitated, temperature controlled, moisture-proof container, such. As fluidized bed, vibrating channel or the rotary drum until the granules are ready solidified, that they no longer adhere in the subsequent step, DOLLAR A e) filling the granules with exclusion of moisture in moisture-proof packaging. DOLLAR A These reactive hot melt adhesives are pourable and free-flowing and therefore to use with all conventional application machines for hot melt adhesives. Special barrel-Aufschmelzeinrichtungen and feed pumps are not necessary.