Low temperature copper de-oxidation
2005
The impact of a post deposition annealing step of ECD copper and of a predeposition annealing step on the Cu seed has been investigated. Compared to forming gas it can be demonstrated that the addition of a small amount of ethanol can very effectively reduce the surface and grain boundary oxidation with benefits for the electrical parameters. The impact of a de-oxidation step down to 100degC on the Cu seed and its consequences for the ECD Cu growth are presented
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI