Software design on TSV-based three-dimensional interconnected

While System in package becomes the mainstream technology of integration package, it is investigated more and more. This paper introduces the research and development of software TSD based on System in package software of chip. Software TSD© (short for TSV Based Sip Designer) is combination simulation software which can draw Interposer model and chip, Interposer, TSV and PCB board. This software contains single and multiple TSV models. Parameter extraction and files storage can conduct simulation design of electromagnet and circuit by external interface.