Ultra-thin dual polarized millimeter-wave phased array system-in-package with embedded transceiver chip

A 16-element dual polarized phased array transmit/receive (Tx/Rx) System-in-Package (SiP) for 60 GHz applications is presented. Embedded die technology is used to achieve total module thickness of only 600 µm, improved first level interconnect density and better electrical performance. The dual polarized antenna architecture enables several configurations of the transmitter and receiver orientation without major impact on the signal to noise ratio (SNR). The proposed system was fabricated on a low loss multilayer organic package substrate, assembled and fully characterized. Single element and phased array performance was evaluated showing very good agreement with the simulation over the 60 GHz ISM band. Active measurements showing good steering and dual polarization characteristics were also performed.