Semiconductor wafer, semiconductor structure and method of manufacturing the same

Semiconductor wafer according to one embodiment of the technical features of the present invention, a notch having an opening formed toward a central portion of the wafer body from the wafer body, the outer periphery of the wafer body having a first surface and a second surface opposite to each other, formed along the periphery of the wafer body, the first surface and the second comprises a first inclined surface connecting the second surface, the second surface and the second from the first side of the first branch meets the first inclined plane the first bevel portion having a first height with respect to the straight line extended to a second point is one inclined surface meet, and is disposed in contact with said opening, and a second inclined surface connecting the first and second surfaces, of the first surface and the first and the second surface and wherein the wherein the second, different height to the first height with respect to the straight line extending from the fourth point to meet the two inclined surfaces from the third point, two inclined surfaces meet Claim comprises two bevel portions.