Semiconductor device and manufacturing method

According to an embodiment, the semiconductor device comprising: a substrate, a plurality of insulating layers, a lower shield plate, the semiconductor device, the upper side portion and the shield plate shielding material. A first contact portion is formed on the substrate. A lower magnetic shield member, the magnetic body on the substrate 1 to avoid the first contact portion is provided. The semiconductor chip is disposed on the lower shield plate, having a second contact portion connected to the first electrical contact portion. An upper magnetic shield member, the magnetic body on the semiconductor chip to avoid the contact portion of the second embodiment and the connecting member is provided. Side shielding material using a magnetic body, said magnetic shield plate and a lower portion of the upper shield plate is not arranged side connector is connected.