Low Loss NCF Material for High Frequency Device

Low dielectric loss non-conductive film has been developed. The dielectric dissipation factor was 0.006. In the assembly process, non-conductive film afforded both excellent lamination-ability to the bumped wafer and dicing-ability of non-conductive film laminated wafer simultaneously. Furthermore, by changing curing reaction system, it showed high productivity which can form solder joint well without void in non-conductive film for 3 s of the bonding time. In addition, it was confirmed that there was no failure in reliability test.