The photosensitive resin composition, and a photosensitive element using the same, a method for forming a resist pattern manufacturing method and a manufacturing method of the PDP barrier ribs of the printed wiring board.

(A) a binder polymer, (B) a photopolymerizable compound having a polymerizable ethylenically unsaturated bond, (C) 2,4,5 photoinitiated radical polymerization containing triaryl imidazole dimer or a derivative thereof agent, (D) a photosensitive resin composition containing the compound, the represented by the following general formula (1). [Formula 1] In formula (1),