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625 Deformation Behavior of Ceramic Substrate with Thick Cu Layer in Joining Process
625 Deformation Behavior of Ceramic Substrate with Thick Cu Layer in Joining Process
2015
Yu Harubeppu
Hisashi Tanie
Koji Sasaki
Nobuhiko Chiwata
Hiroyuki Teshima
Keywords:
Ceramic
Substrate (chemistry)
Deformation (mechanics)
Metallurgy
Materials science
Composite material
ceramic substrate
Correction
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