A Novel Modular Design and Modeling Methodology for High Speed High Density Die Package PCB Co-Simulation and Model Library Creation

This paper proposes a novel modular design concept for package physical design, and a modularized and parameterized modeling technique for package model library creation. The proposed modular design reduces the physical design/review cycle by ~50% and can significantly improve the performance consistency. The modularized modeling technique requires the breakdown of the full package model into vertical and horizontal subsets. These subsets are either re-usable or scalable for generating a parameterized full package model. This methodology takes into account the discontinuities at all module interfaces and can therefore accurately capture the entire dimension mismatch. It renders the simulation time 2-5x less, enabling a more efficient die-package-PCB co-simulation. This modeling methodology is used to generate package model library of transceiver channel S parameters and propagation delay. The modeling methodology is validated through comparison to traditional practices in both frequency and time domains and is further correlated to the lab measurements.