An Investigation into the Temperature Distribution in High Density Electronics Packaging

System In Packaging SIP is a brand-new technology of electronics packaging. In order to investigate the characteristics of this high density electronics packaging,a math-ematic model of SIP electronics is developed and used to simulate the heat transfer process and temperature distribution inside the electronics. The effects of different design and physical parameters on temperature distribution are examined by the model. Based on the simulation, the control procedure in heat transfer and the possibility for enhancing heat dispersion are discussed.