Stripping method and a method for manufacturing a display device using the separation method

The present invention simplifies the separation step and provides a method of uniformly performing peeling and transfer for a large substrate. The present invention is carried out first and the peeling of the adhesive in the release process, the hardening of the second adhesive, at the same time, characterized in that to simplify the manufacturing process. The present invention is characterized by devising the timing of transferring the layer to be peeled formed to the electrode of the semiconductor element to a predetermined substrate. Especially when performing peeling while forming a plurality of semiconductor elements on a large substrate, and performing peeling by adsorbing the substrate by utilizing the pressure difference.