Thermosetting resin composition, prepreg, laminate, and printed circuit board

Provided are a thermosetting resin composition, prepreg, laminate, and printed circuit board having high heat resistance, a low dielectric constant, high metal-foil adhesivenesss, a high glass-transition temperature, and low thermal expansion, as well as good formability and plating characteristics. The thermosetting resin composition specifically contains (A) 15-65 parts by mass of a maleimide compound having a N-substituted maleimide group, (B) 15-50 parts by mass of an epoxy resin having at least two epoxy groups in a molecule, (C) 10 to 45 parts by mass of a copolymer resin having structural units derived from an aromatic vinyl compound and structural units derived from maleic anhydride (where the total of the components (A) to (C) is 100 parts by mass.), and (D) 0.5-6 parts by mass of dicyandiamide with respect to the total 100 parts by mass of the (A) to (C) components.