Dual-Band 5G Antenna Array in Fan-Out Wafer-Level Packaging (FOWLP) Technology

In this paper, a 1x2 dual-band microstrip antenna array configuration in FOWLP technology for 5G applications operating in the 28GHz and 38GHz frequency bands is proposed. For the first time an antenna array is designed, simulated and fabricated on 200μm mold substrate material for a compact 1cmx1cm Antenna-in-Package module. Results show very good correlation between simulation and measurement.