The Synthesis of Liquid Crystalline Epoxy Resin and Its Application in Large-scale Integrated Circuits Packaging

MEP (mono-functional epoxy group prepolymer) was prepared through reacting biphenol with epichlorohydrin, and the structure were determined by FTIR, XRD and polarizing microscope. Epoxy molding composite(EMC) used for the packaging of ultra-large-scale integrated circuit (IC) was prepared by mixing the liquid crystalline epoxy resin with ortho-cresol novolac epoxy (ECN) using high-speed pre- mixing and twin roller mixing and the better formulation and process parameters had been obtained in this paper. The results have shown that the EMC has the ordered domain of liquid crystalline structure.