A Meeting of Materials: Integrating Diverse Semiconductor Technologies for Improved Performance at Lower Cost

Semiconductor technology has seen rapid advances in recent years. Complementary?metal-oxide-semiconductor (CMOS) technology is providing tremendous digital processing power by integrating billions of transistors. Indium phosphide (InP) has bridged the terahertz frequency barrier. Gallium nitride (GaN) is offering unprecedented solid-state RF power across the microwave spectrum. Diverse, accessible heterogeneous integration (DAHI) allows engineers to take advantage of all of these advances by combining them along with other semiconductor technologies onto a single chip. DAHI offers the ultimate in RF, mixedsignal, and digital capability for future mobile applications that will demand smaller size and weight with lower power and cost.