Method for treating electronic device by use of microwave emission
1993
PURPOSE: To burn in an electronic device, electrically thermally perform stress tests, and further reduce the leakage current in rectifying joining in the device by exposing the electronic device to microwave emission. CONSTITUTION: A microwave is supplied from a microwave supplying source 8, the output 10 of the supplying source 8 is supplied to a three-port circulator 12. The output 16 of the circulator 12 is supplied to a directional coupler 18, and the output 28 of the coupler 18 provides a microwave power to an antenna controlled by an antenna control device 4. In a semiconductor device to be mounted, the microwave power must be controlled to a specified threshold limit or less where the electric overload of the circuit is generated. This is not desirable because it forms a damage exceeding a general obstruction to a chip. Therefore, a process window to the chip to be mounted is provided, and acceleration burn-in is performed therein. COPYRIGHT: (C)1994,JPO
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