The Collaborative Design for the Package of High - speed Interface Chip

In order to meet people's demand for multi-function and miniaturization of electronic products, the integration degree of electronic products is constantly improving and the speed is getting faster and faster. The research takes an actual DDR3 controller package design as the background. And the chip adopts advanced packaging collaborative design, including die-package-PCB collaboration design and design-simulation collaboration design. Packaging is evaluated in terms of electrical integrity, thermal mechanical properties, manufacturability, testability and so on during package.