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1104 The Increase Mechanism of Thermal Cycling Induced Curvature Deformation in Semiconductor Package
1104 The Increase Mechanism of Thermal Cycling Induced Curvature Deformation in Semiconductor Package
2008
Yasuhisa Fujimoto
Mitsuru Satô
Hiroo Sakamoto
Shinichi Takagi
Hiroshi Kawata
Keywords:
Deformation (mechanics)
Temperature cycling
Curvature
Structural engineering
Composite material
Materials science
Semiconductor package
Correction
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