The composite dielectric structure having a low k

There is provided a method of forming a composite intermetallic dielectric structure. An initial intermatallische dielectric structure is provided that includes a first dielectric layer and two conductor paths. The two conductor tracks are located in the first dielectric layer. A portion of the first dielectric layer is removed between the conductor tracks to form a recess. The well is filled with a second dielectric material. The second dielectric material is a low K dielectric having a lower dielectric constant than the first dielectric layer.