A method of preparing a microwave dielectric composite high-frequency dielectric substrate

The present invention relates to a method of preparing a composite high frequency high dielectric microwave dielectric substrate. The steps: first by the ratio of ceramic powder mixed with the acid solution, and then adding a certain amount of the silane coupling agent, and then added to the resin, was heated with stirring, and drying to obtain a ceramic mixed powder; ceramic tile mixed powder in a mold, repeated shocks to make it smooth; the charged mold was placed in a hot press forming cold, room temperature, a pressure of 3 ~ 12MPa; both surfaces of the substrate after the final cold forming copper foil are covered, again placed in a mold , the sintering machine in hot pressing sintering, heat 2 ~ 10h at a temperature of 350 ~ 390 ℃, pressure of 5 ~ 22Mpa, then allowed to cool. High dielectric composite high frequency microwave dielectric substrate prepared by the present process have excellent mechanical properties, high dielectric constant, low dielectric loss, good uniformity and high density and to meet high-frequency high-dielectric microwave dielectric substrate composite Market demand.