Effect of Micro In-element on the Oxidation Resistance of Sn-0.3Ag-0.7Cu Lead-free Solder

Addition of micro In-element may raise the oxidation resistance of Sn-0.3Ag-0.7Cu.The research results show that addition of micro In-element may improve the oxidation resistance of lead-free solder greatly.In the case the content of In-element is 0.025% in lead-free solder,both the oxidation resistance and wetting property present best performance.The anti-oxidation effect is available only when the temperature of solder is below 300 ℃.It is found that In-element can be oxidized preferentially in alloy,which consequently prevents solder from further oxidation.