Old Web
English
Sign In
Acemap
>
Paper
>
듀얼 타입 웨이퍼 레벨 몰딩시스템 개발
듀얼 타입 웨이퍼 레벨 몰딩시스템 개발
2016
연시모
박진호
손용
이혜진
Keywords:
Wafer-level packaging
Compression molding
Die (integrated circuit)
Die preparation
Manufacturing engineering
Composite material
Materials science
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]