Adhesive which can be removed by controlled heat treatment and emi shield film using adhesive

The present invention (i) (a) epoxy resin, (ii) a curing agent, (iii) comprises an epoxy resin capable of producing a tertiary ester bond after the epoxy resin or (b) curing comprising a tertiary ester bond curing promoter, (iv) modifying a thermoplastic resin, and (v) comprises a conductive particle, wherein (i) (a) an epoxy resin containing a tertiary ester bond, or (b) capable of producing a tertiary ester bond after curing an epoxy resin provides the complete epoxy resin of 100 parts by weight based on from 40 to 55 parts by weight of the electromagnetic wave shielding film comprising the adhesive resin composition and an electromagnetic wave-shielding film using the same for characterized in that. An object of the present invention is to provide an adhesive for the electromagnetic wave shielding film can be removed by a simple heat treatment and electromagnetic wave-shielding film using the same.