Arrangement of an electrical component with an electrical insulation film on a substrate and method of manufacturing the arrangement

The invention relates to an assembly of an electrical component (3) on a substrate (2), wherein at least one electrically insulating film (5) is provided for electrical insulation of the component and at least a portion (52) of the insulating film with the component and the substrate connected such is that a given by the component and the substrate surface contour (11) in a surface contour (51) of the part of the insulating film is shown. The arrangement is characterized in that the insulation film (5) having a voltage resistance to an electric field strength of more than 10 kV / mm and preferably greater than 50 kV / mm. For manufacturing the arrangement, the insulating film is laminated. This is preferably done under vacuum. Thus, a particularly intimate contact between the insulation film and the component is achieved. The component is in particular a power semiconductor device. Through the insulation film ensures that despite the used in the operation of such devices high electrical voltages, even in exposed locations of the device, ie at corners or edges that may cause excessive field increases, will be no electric arcing.