Direct copper electrodeposition onto cobalt adhesion layer in alkaline bath

The direct electroplating of copper film on an ultrathin cobalt film in the alkaline bath was investigated. The plating bath consists of CuSO 4 ·5 H 2 O and ethylenediamine. It is found that the ethylenediamine can well stop the cobalt reaction with copper ion and make the copper deposition on cobalt possible. The experimental results show that the copper films on the cobalt have a high preferential (111) orientation, very low surface roughness and low resistivity.