Stud bump structure and methods of forming

Embodiment of the present invention provides a structure and method for forming a stud bump. Stud bump structure includes a substrate; and a first silver alloy stud bump, is provided on the substrate, wherein the first silver alloy stud bump BOC: Gold: Pd weight ratio = 60 to 99.98: 0.01 to 30: 0.01 ~ 10. Stud bump structure of the present invention has extremely high reliability.