Presintered semiconductor chip structure

A sintered compound is formed by pressing a semiconductor chip to a substrate while a dried sintered material is located between the substrate and the semiconductor chip, wherein the dried sintered material sintered particles and a solvent. The substrate is heated to a temperature below the sintering temperature of the dried sintered material, while the semiconductor chip is pressed against the substrate to form local sintered connections between adjacent sintered particles. The local sintering compounds form a stable compound which fixes the semiconductor die prior to sintering to the substrate. Then, a sintered connection between the semiconductor chip and the substrate from the dried sintered material is formed after the stable compound is formed.