For semiconductor encapsulation liquid epoxy resin composition and resin-sealed semiconductor device

(A) a liquid epoxy resin containing no siloxane bond in the molecule, (B) an acid anhydride curing agent, (C) the average particle size 0.1~10μm spherical inorganic filler measured by a laser diffraction method as the inorganic filler, the surface thereof is (meth) acrylic functional silane coupling agent, (C) components in spherical surface treated surface treated spherical inorganic filler in an amount of 0.5 to 2.0 parts by mass with respect to the inorganic filler 100 parts by weight, (D) relates to a semiconductor encapsulating liquid epoxy resin composition comprising a curing accelerator, according to the present invention, it is possible to provide heat resistance, a semiconductor device having excellent moisture resistance.