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Solder joint geometry of tin-lead alloy and its application in electronic packaging
Solder joint geometry of tin-lead alloy and its application in electronic packaging
1999
Gz Wang
Qn Zhu
Zn Cheng
Cq Wang
Yy Qian
Keywords:
Soldering
Alloy
Electronic packaging
Tin
Materials science
Metallurgy
lead alloy
Correction
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