Printed circuit board and method for manufacturing same

The invention discloses a printed circuit board and a method for manufacturing the same. The method for manufacturing the printed circuit board includes a nonmetal plated through hole forming procedure and at least one electroplating procedure. The nonmetal plated through hole forming procedure is executed after the electroplating procedures are completed. The printed circuit board is manufactured by the aid of the method. The printed circuit board and the method for manufacturing the printed circuit board have the advantages that nonmetal plated through holes are formed after all electroplating processes are completed in an integral circuit board manufacturing procedure, accordingly, a circuit board with the nonmetal plated through holes is no longer subjected to the electroplating processes, and the problem that the inner walls of NPTH (nonmetal plated through holes) are polluted by copper metal due to the fact that the existing nonmetal plated through holes and plated through holes are formed together at present can be solved.