A method of manufacturing a semiconductor wafer with adhesive layer, the photosensitive adhesive and a semiconductor device
2011
On one entire surface of the semiconductor wafer, comprising the steps of forming a photosensitive adhesive layer by applying the photosensitive adhesive by screen printing, a step of B-staging by exposing the photosensitive adhesive layer, the the method of manufacturing a semiconductor wafer with an adhesive layer.
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