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Double Side System in Package Development Challenge for Heterogeneous Integration
Double Side System in Package Development Challenge for Heterogeneous Integration
2019
Feng Kao
Yu-Po Wang
Davidlion Wang
Jensen Tsai
Mike Tsai
Ryan Chiu
Eric He
Keywords:
Embedded system
Computer science
System in package
Surface-mount technology
Image warping
Dissipation
Product design
Molding (process)
Internet of Things
Mechanical engineering
Accelerated life testing
Correction
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