Pd effect on reliability of Ag bonding wires in microelectronic devices in high-humidity environments

We investigated the effect of Pd concentration in Pd-doped Ag wires on the humidity reliability and interfacial corrosion characteristics between Ag wire and Al metallization. Additionally, we confirmed no corrosion problem between Ag wire and noble metal (Pd, Au) metallization, even after a pressure cooker test (PCT). The chemical composition of the tested Ag wires was pure Ag, Ag-1wt% Pd and Ag-3wt% Pd. These wires were bonded to Al and noble metal (Au, Pd) metallization using a thermo-sonic bonder. The interfaces were characterized by focused ion beam (FIB), high resolution transmission electron microscope (HRTEM) and energy dispersive X-ray spectroscopy (EDS). The interface corrosion of Pd doped Ag wires was significantly reduced as the Pd concentration in the Ag wires increased. Furthermore, the Ag wires on the noble metal (Au, Pd) metallization exhibited stable reliability during the PCT.