BCB (Benzocylcobutene) process integration for the RF passive device

For the on-chip antenna (OCA) application, the authors successful integrate the radio frequency (RF) component (inductor) by the BCB interconnect. The electrical yield of BCB interconnect is more than 80%. The peak Q-value of the inductor that was integrated by BCB interconnects is 36 at frequency 7.78GHz. At the same time, the cost and process time are reduced to half. BCB can be used in the post-process for the RF passive integration.