Adhesives for Assembly on Printed-Circuit Boards
2007
Requirements for adhesives used in the surface-mount technique are presented. Properties of a heat-setting epoxy adhesive TPK-4 designed at the Semenov Institute of Chemical Physics of the Russian Academy of Sciences together with the OOO NPF Tekhpolikom are described.
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
0
References
1
Citations
NaN
KQI